3D Integration in VLSI Circuits

The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs.

1. Three-Dimensional Integration: Technology and Design P. Franzon 2. Three-Dimensional System-in-Package for Application-Specific Integrated Circuit and Three-Dimensional Dynamic Random-Access Memory Integration Li Li 3. A New Class of High-Capacity, Resource-Rich Field-Programmable Gate Arrays Enabled by Three- Dimensional Integration Chip-Stacked Silicon Interconnect Technology Suresh Ramalingam, Henley Liu, Myongseob Kim, Boon Ang, Woon-Seong Kwon, Tom Lee, Susan Wu, Jonathan Chang, Ephrem Wu, Xin Wu, and Liam Madden 4. Challenges in 3D Integration M. Koyanagi, T. Fukushima, and T. Tanaka 5. Wafer-Level Three-Dimensional Integration Using Bumpless Interconnects and Ultrathinning Takayuki Ohba 6. Three-Dimensional Integration Stacking Technologies for High-Volume Manufacturing by Use of Wafer-Level Oxide-Bonding Integration Spyridon Skordas, Katsuyuki Sakuma, Kevin Winstel, and Chandrasekharan Kothandaraman 7. Toward Three-Dimensional High Density S. Cheramy, A. Jouve, C. Fenouillet-Beranger, P. Vivet, and L. Di Cioccio 8. Novel Platforms and Applications Using Three-Dimensional and Heterogeneous Integration Technologies Kuan-Neng Chen, Ting-Yang Yu, Yu-Chen Hu, and Cheng-Hsien Lu